Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days |
| Packaging Details | Vacuum |
| Glass Epoxy | RO3006 |
| Final height of PCB | 0.3 mm ±0.06 |
| Final foil external | 1 oz |
| Final foil internal | 1 oz |
| Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel |
| Solder Mask Color | NO |
| Colour of Component Legend | Black |
| TEST | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-0045-V8.67 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
Rogers High Frequency PCB Built on 20mil 0.508mm RO4350B With Immersion Gold and
Taconic High Frequency PCB Made on TLY-5 7.5mil 0.191mm With DK2.2 for
RT/Duroid 5880 10mil 0.254mm Rogers High Frequency PCB for Microstrip and
Taconic RF-60A PCB 60mil 1.5mm High Frequency PCB With Immersion Silver For
Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
| Delivery Time | 5-6 working days | Packaging Details | Vacuum |
| Glass Epoxy | RO3006 | Final height of PCB | 0.3 mm ±0.06 |
| Final foil external | 1 oz | Final foil internal | 1 oz |
| Surface Finish | Immersion gold (51.3% ) 0.05µm over 3µm nickel | Solder Mask Color | NO |
| Colour of Component Legend | Black | TEST | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-0045-V8.67 |
| Certification | UL | Place of Origin | China |
Rogers RO3006 High Frequency PCB 2-Layer Rogers 3006 10mil Circuit Board DK6.15 DF 0.002 Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3006 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
PCB Specifications
| PCB SIZE | 152 x 152mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3006 0.254mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 14 mil / 14 mil |
| Minimum / Maximum Holes: | 0.4 mm / 4.0 mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 1 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3006 0.254mm |
| Final foil external: | 1 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1mm |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3006 (RO3006)
| RO3006 Typical Value | |||||
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Get in touch with us
Leave a Message, we will call you back quickly!