Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 2 |
| Board Material | Polyimide 50µm |
| Surface Cu thickness | 1.0 |
| Board Thickness | 0.20 mm +/-10% |
| Surface Finish | Immersion Gold |
| Solder Mask Color | Yellow |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise |
| Model Number | BIC-297-V2.97 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 2 | Board Material | Polyimide 50µm |
| Surface Cu thickness | 1.0 | Board Thickness | 0.20 mm +/-10% |
| Surface Finish | Immersion Gold | Solder Mask Color | Yellow |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Enterprise | Model Number | BIC-297-V2.97 |
| Certification | UL | Place of Origin | China |
Rogers RO3003 Ceramic-Filled PTFE Composites
Rogers RO3003 laminates are a ceramic-filled PTFE composite material suitable for high-frequency applications up to 77 GHz. The material offers stable dielectric properties over varying temperatures and frequencies, making it well-suited for today's advanced wireless technologies.
Features and Specifications
RO3003 laminates have a dielectric constant of 3 +/- 0.04 at 10 GHz and 23°C. Dissipation factor is a very low 0.001, also at 10 GHz/23°C. The high degradation temperature (Td) of over 500°C allows for robust performance. Additional key specs include a thermal conductivity of 0.5 W/mK, moisture absorption of 0.04%, and coefficient of thermal expansion values of 17 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 25 ppm/°C (Z-axis).
Performance Benefits
The low dielectric loss of RO3003 means it can be used at frequencies up to 77 GHz for applications like automotive radar and 5G infrastructure. The material maintains consistent mechanical properties over a wide temperature range, making it reliable for multilayer board construction. Its stable dielectric constant with temperature and frequency variation is ideal for components like filters, antennas, and oscillators. In addition, the close match between the laminate's expansion coefficient and that of copper supports more robust surface-mounted assemblies less susceptible to thermal stresses.
Potential Drawbacks
Higher costs may be associated with RO3003 compared to other substrate materials, as it requires a specialized ceramic-filled composition. Additional machining may also be needed for high-precision applications due to the material's hardness. Some designers also note the need for tighter design tolerances compared to more flexible substrate options.
Sample Applications
Provided here is a sample 2-layer PCB design specification and construction details using RO3003 laminates. Typical applications for the material include automotive radar, satellite antennas, wireless communications infrastructure, and other high-frequency devices where stable electrical and mechanical properties are required. The global volume manufacturing capability also makes RO3003 affordable for high-volume production runs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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