Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T,Paypal |
| Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY |
| Packaging Details | VACUUM |
| Board Material | Polyimide 12.5μm + 0.2mm polyimide stiffener |
| Board Thickness | 0.15 mm |
| Surface/Inner layer Cu thickness | 35 µm |
| Surface Finish | Immersion Gold |
| Coverlay Colour | Yellow |
| Color of Silkscreen | White |
| Function | 100% Pass electrical test |
| Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0303-V3.03 |
| Certification | UL |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T,Paypal | Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY | Packaging Details | VACUUM |
| Board Material | Polyimide 12.5μm + 0.2mm polyimide stiffener | Board Thickness | 0.15 mm |
| Surface/Inner layer Cu thickness | 35 µm | Surface Finish | Immersion Gold |
| Coverlay Colour | Yellow | Color of Silkscreen | White |
| Function | 100% Pass electrical test | Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0303-V3.03 |
| Certification | UL | Place of Origin | CHINA |
Introduction:
Welcome to the next generation of high-performance PCB materials. We proudly present TLX-8, a game-changing solution designed to revolutionize the world of advanced electronics. With its outstanding properties and unwavering reliability, TLX-8 sets new standards in the industry, empowering cutting-edge electronic applications.
Unraveling Unparalleled Dielectric Prowess:
TLX-8 emerges as the undisputed champion of dielectric materials, offering an unparalleled DK (dielectric constant) of 2.55 at 10 GHz. This remarkable attribute ensures swift and efficient signal transmission. Equally impressive is its meager Df (dissipation factor) of 0.0012 at 1.9 GHz and 0.0017 at 10 GHz, minimizing signal loss and elevating electrical performance to unprecedented heights.
Unyielding Mechanical Fortitude:
Prepare to be amazed by the resolute strength of TLX-8. Flexural strength becomes its superpower, flexing its muscle at a staggering 28,900 psi (approximately 199.6 MPa) in the machine direction (MD) and 20,600 psi (approximately 142.1 MPa) in the cross-direction (CD). Brace yourself for the tensile strength of 35,600 psi (approximately 245.3 MPa) in the MD and 27,500 psi (approximately 189.6 MPa) in the CD.
Uncompromising Resilience:
TLX-8 revels in its ability to withstand and endure. Exhibiting an elongation at break of 3.94% in both the MD and CD directions, it refuses to yield under pressure. Encapsulating this tenacity is its Young's Modulus, a remarkable 980 kpsi (approximately 6,758 MPa) in the MD and 1,200 kpsi (approximately 8,274 MPa) in the CD, truly epitomizing stability and unyielding strength.
Thermal and Electrical Brilliance:
Behold TLX-8's thermal mastery, as it dissipates heat with unparalleled finesse. With a thermal conductivity of just 0.19 W/M*K, it ensures optimal thermal management, a vital consideration in high-power applications. Witness TLX-8's unwavering dimensional stability, barely flinching under varying thermal stress conditions, with minimal fluctuations in mils/inch (mm/M) in both the MD and CD.
Reliability and Safety Uncompromised:
TLX-8 stands tall in the realm of reliability, boasting a dielectric breakdown strength surpassing 45 kV. This impenetrable barrier protects against electrical breakdown, fortifying the longevity of electronic devices. Furthermore, with a moisture absorption rate of a mere 0.02%, TLX-8 remains impervious to environmental conditions that could compromise performance.
Igniting Innovation, Ensuring Safety:
TLX-8's UL-94 flammability rating of V-0 underscores its commitment to unwavering safety standards. With a density of 2.25 g/cm3, it offers a lightweight solution without compromising on performance, igniting innovation while keeping environmental considerations at the forefront.
Conclusion:
TLX-8 represents a paradigm shift in PCB materials, ushering in a new era of excellence in advanced electronics. Its unmatched dielectric properties, unwavering mechanical strength, exceptional thermal conductivity, and steadfast reliability make it the material of choice for those seeking superior performance and durability. With TLX-8, engineers and designers can push the boundaries of what's possible, forging a future where unimaginable possibilities become reality.
| Property | Test Method | Unit | TLX-8 Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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