Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T,Paypal |
| Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY |
| Packaging Details | VACUUM |
| Board Material | Polyimide 25µm |
| Board Thickness | 0.20 mm |
| Surface/Inner layer Cu thickness | 35 µm |
| Surface Finish | Immersion Gold |
| Coverlay Colour | Black |
| Color of Silkscreen | White |
| Function | 100% Pass electrical test |
| Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited |
| Model Number | BIC-0273-V2.73 |
| Certification | UL |
| Place of Origin | CHINA |
View Detail Information
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Product Specification
| Payment Terms | T/T,Paypal | Supply Ability | 50000 PIECE PER MONTH |
| Delivery Time | 8-9 WORKING DAY | Packaging Details | VACUUM |
| Board Material | Polyimide 25µm | Board Thickness | 0.20 mm |
| Surface/Inner layer Cu thickness | 35 µm | Surface Finish | Immersion Gold |
| Coverlay Colour | Black | Color of Silkscreen | White |
| Function | 100% Pass electrical test | Number of Layers | 2 |
| Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0273-V2.73 |
| Certification | UL | Place of Origin | CHINA |
Announcing Our New Go-To Substrate for High-Performance RF Design - Rogers RO3010
We're excited to introduce RO3010, Rogers' latest laminate material perfectly tailored for pushing the boundaries of RF circuit design. This innovative substrate delivers unmatched thermal and electrical stability to help unleash your boldest innovations.
Dimensional Precision
With industry-leading dimensional stability from -40°C to 500°C, RO3010 ensures ultra-precise performance even under extreme operating conditions. Its ceramic-composite construction delivers Cohen's thermal expansion as low as 11-16ppm/°C, virtually eliminating warping concerns.
Pristine Signal Integrity
Dielectric constant of 10.2 and losses below 0.0022 up to 10GHz provide sparkling clean signal transmission. Complex multilayer circuits benefit from RO3010's ability to maintain tight impedance tolerances at high frequencies.
Advanced Thermal Management
Thermal conductivity of 0.95W/mK efficiently dissipates heat, protecting temperature-sensitive components. Its composition also withstands short thermal excursions outside rated ranges.
Cutting-Edge Manufacturing
Prototypes use our standard 35μm copper 2-layer stackup with 0.635mm RO3010 core. Multi-layer designs are happily accommodated as well. All boards receive IPC Class 2 processing including immersion silver finishing.
Contact the Experts
Push your designs to new frontiers with RO3010 as your foundation. Reach out for custom multilayer configurations, volume pricing or application support from our experienced engineering team. Let's help maximize your innovation's potential.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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