Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | Vacuum |
| Number of Layers | 6 |
| Glass Epoxy: | S1000-2M |
| Final foil | 1.5 Oz |
| Final height of PCB: | 1.6 mm ±10% |
| Surface Finish | Immersion gold |
| Solder Mask Color: | Blue |
| Colour of Component Legend | White |
| Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-505-V0.45 |
| Certification | UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | Vacuum |
| Number of Layers | 6 | Glass Epoxy: | S1000-2M |
| Final foil | 1.5 Oz | Final height of PCB: | 1.6 mm ±10% |
| Surface Finish | Immersion gold | Solder Mask Color: | Blue |
| Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
| Brand Name | Bicheng Technologies Limited | Model Number | BIC-505-V0.45 |
| Certification | UL | Place of Origin | China |
6 Layers High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control for Communications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M (for more details about S1000-2M, please refer to Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper). It’s 6-layer board with 1 oz copper each layer, coating with immersion gold and blue solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.
Applications
Computers
Communications
Automotive electronics etc.
PCB Parameters
| Item | Description | Requirement | Actual | Result | ||
| 1. Laminate | Material Type | FR-4 S1000-2M | FR-4 S1000-2M | ACC | ||
| Tg | 170 | ℃ | 170 | ℃ | ACC | |
| Supplier | SHENGYI | SHENGYI | ACC | |||
| Thickness | 1.6 | ±10% mm | 1.63-1.68 | mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25 | µm | 30.17 | µm | ACC |
| Outer copper | 35 | µm | 41.09 | µm | ACC | |
| Inner Copper | 30 | µm | 33.69 | µm | ACC | |
| 3.Solder mask | Material Type | KSM-S6189BL04 | KSM-S6189BL04 | ACC | ||
| Color | Blue | Blue | ACC | |||
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |||
| S/M Thickness | ≥10 | µm | 20.11 | µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |||
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC | ||
| Color | White | White | ACC | |||
| Location | C/S | C/S | ACC | |||
| 5. Peelable Solder Mask | Material Type | |||||
| Thickness | ||||||
| Location | ||||||
| 6. Identification | UL Mark | YES | YES | ACC | ||
| Date Code | WWYY | 0421 | ACC | |||
| Mark Location | Solder Side | Solder Side | ACC | |||
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC | ||
| Tin Thickness | ||||||
| Nickel Thickness | 3-6 | µm | 4.06 | µm | ACC | |
| Gold Thickness | 0.1 | µm | 0.12 | µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC | ||
| REACH | Directive 1907 /2006 | OK | ACC | |||
| 9.Annular Ring | Min. Line Width (mil) | 6.00 | mil | 5.80 | mil | ACC |
| Min. Spacing (mil) | 5.00 | mil | 5.20 | mil | ACC | |
| 10.V-groove | Angle | |||||
| Residual thickness | ||||||
| 11. Beveling | Angle | |||||
| Height | ||||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC | ||
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | ||
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |||
| Warp and Twist | ≦ | 0.70% | 0.21% | ACC | ||
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC | ||
| Solvent Test | No Peeling | OK | ACC | |||
| Solderability Test | 265 ±5℃ | OK | ACC | |||
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |||
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56 | µg/c㎡ | ACC | ||
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.375 | 0.375 | 0.400 | 0.400 | 0.375 | ACC |
| 2 | Y | 0.500 | 0.500 | 0.550 | 0.525 | 0.525 | ACC |
| 3 | Y | 0.7*2.4 | 0.7*2.4 | 0.7*2.41 | 0.69*2.4 | 0.7*2.4 | ACC |
| 4 | Y | 0.625 | 0.625 | 0.600 | 0.625 | 0.600 | ACC |
| 5 | Y | 0.725 | 0.725 | 0.725 | 0.750 | 0.725 | ACC |
| 6 | Y | 0.900 | 0.925 | 0.900 | 0.900 | 0.900 | ACC |
| 7 | Y | 1.000 | 1.000 | 0.950 | 0.975 | 1.000 | ACC |
| 8 | N | 1.050 | 1.050 | 1.050 | 1.075 | 1.050 | ACC |
| 9 | Y | 1.300 | 1.300 | 1.300 | 1.325 | 1.325 | ACC |
| 10 | Y | 1.350 | 1.350 | 1.325 | 1.350 | 1.325 | ACC |
| 11 | Y | 1.575 | 1.575 | 1.600 | 1.600 | 1.575 | ACC |
| 12 | Y | 1.650 | 1.650 | 1.700 | 1.675 | 1.675 | ACC |
| 13 | Y | 1.700 | 1.700 | 1.750 | 1.725 | 1.725 | ACC |
| 14 | Y | 3.250 | 3.250 | 3.250 | 3.275 | 3.250 | ACC |
| 15 | Y | 3.450 | 3.450 | 3.400 | 3.425 | 3.450 | ACC |
| 16 | Y | 0.7*2.6 | 0.7*259 | 0.7*2.61 | 0.69*2.6 | 0.7*2.59 | ACC |
Electrical Test Report
| Test Type | Flying Probe | Testing Points | 1250 | Testing Time | 1/25/2021 | Quantity | 80 | Pieces |
| Testing Condition | Voltage | 250V | Conductive Resistance | 20 Ω | ||||
| Current | 100 mA | Isulation Resistance | 20 mΩ | |||||
| Testing Result | Quantity Passed | 80 | Pieces | Passing Rate | 100% | |||
| Quantity Rejected | 0 | Pieces | ||||||
| Open Circuits | 0 | Pieces | Short Circuits | 0 | Pieces | |||
| Conductive Non-confirming | 0 | Pieces | Insulation Non-confirming | 0 | Pieces | |||
Impedance Test Report
| Sample NO. | Layer | Line Width(mil)±10% | Line Space (mil)±10% | Impedance Type | Required Value (ohm) | Tolerance | Actual Value | Result | |
| Single End | Differential | ||||||||
| 1 | L3 | 6.000 | 7.000 | V | 90.00 | ±10% | 93.59 | ACC | |
| L3 | 6.000 | 10.000 | V | 100.00 | ±10% | 102.33 | ACC | ||
| L4 | 7.000 | 7.000 | V | 90.00 | ±10% | 88.99 | ACC | ||
| L4 | 6.000 | 7.000 | V | 90.00 | ±10% | 90.76 | ACC | ||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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