Anterwell Technology Ltd.
| Payment Terms | T/T, Western Union,PayPal |
| Supply Ability | 290PCS |
| Delivery Time | 1 Day |
| Packaging Details | please contact me for details |
| Supply voltage | 18 V |
| Differential input voltage | ±VDD |
| Input voltage range | –0.3 V to VDD |
| Input current | ±5 mA |
| output current | ±30 mA |
| Brand Name | TI |
| Model Number | TLC272CPWR |
| Certification | Original Factory Pack |
| Place of Origin | Original |
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Product Specification
| Payment Terms | T/T, Western Union,PayPal | Supply Ability | 290PCS |
| Delivery Time | 1 Day | Packaging Details | please contact me for details |
| Supply voltage | 18 V | Differential input voltage | ±VDD |
| Input voltage range | –0.3 V to VDD | Input current | ±5 mA |
| output current | ±30 mA | Brand Name | TI |
| Model Number | TLC272CPWR | Certification | Original Factory Pack |
| Place of Origin | Original | ||
| High Light | chip in electronics ，small scale integrated circuits | ||
Description
The TLC272 and TLC277 precision dual operational amplifiers combine a wide range of input offset voltage grades with low offset voltage drift, high input impedance, low noise, and speeds approaching those of general-purpose BiFET devices. These devices use Texas Instruments silicongate LinCMOS technology, which provides offset voltage stability far exceeding the stability available with conventional metal-gate processes. The extremely high input impedance, low bias currents, and high slew rates make these costeffective devices ideal for applications previously reserved for BiFET and NFET products. Four offset voltage grades are available (C-suffix and I-suffix types), ranging from the low-cost TLC272 (10 mV) to the high-precision TLC277 (500 µV). These advantages, in combination with good common-mode rejection and supply voltage rejection, make these devices a good choice for new state-of-the-art designs as well as for upgrading existing designs.
equivalent schematic (each amplifier
TLC272Y chip information This chip, when properly assembled, displays characteristics similar to the TLC272C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.
Company Details
Business Type:
Distributor/Wholesaler,Trading Company
Year Established:
2004
Total Annual:
500000-1000000
Employee Number:
20~30
Ecer Certification：
Site Member
King--- Originator of ANTERWELL, engaged in the IC electronics industry in 1998 and establish ANTERWELL in 2004. The company is located in Shenzhen Huaqiang North, the largest electronic center in Asia. Our main business is the technical development and ... King--- Originator of ANTERWELL, engaged in the IC electronics industry in 1998 and establish ANTERWELL in 2004. The company is located in Shenzhen Huaqiang North, the largest electronic center in Asia. Our main business is the technical development and ...
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