| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport |
| Delivery Time | 4-5 weeks |
| Payment Terms | T/T |
| Supply Ability | Stable supply |
| Silver Content (wt.%) | 80~90 |
| Viscosity (Pa·S) | 150~220 |
| Fineness (μm) | ≤8 |
| Printing Accuracy:(μm) | 30~120 |
| Shrinkage Rate (%) | 15~18 |
| Name | Inductor Inner-Electrode Silver Paste |
| Core Functions | Form internal conductive coils or electrodes |
| Key Features | Good fowability,thixotropy,uniformity,and ceramic wettability. The printed electrodes are smooth,dense, anduniform,making them suitable for manufacturing fine conductive adhesive films |
| Application Field | Specifically engineered for internal electrode fabrication in MLCIs,high-frequency inductors,and ferritebeads. It is optimized for fine-line metallization in signal processing and power modules across 5G/6Ginfrastructure,smartphones,and automotive ECUs. |
| Brand Name | APG |
| Place of Origin | china |
| Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
View Detail Information
Explore similar products
Sputtering Target Bonding Adhesive Process Friendly Stress Buffering
Safe Durable Electrically Conductive Silver Paste For Automotive Glass
PCB Through Hole Silver Paste For Interlayer Electrical Connection
Automotive Anti Glare Rearview Mirror Conductive Silver Paste
Product Specification
| Packaging Details | Vacuum-sealed packaging, case-packed for storage and transport | Delivery Time | 4-5 weeks |
| Payment Terms | T/T | Supply Ability | Stable supply |
| Silver Content (wt.%) | 80~90 | Viscosity (Pa·S) | 150~220 |
| Fineness (μm) | ≤8 | Printing Accuracy:(μm) | 30~120 |
| Shrinkage Rate (%) | 15~18 | Name | Inductor Inner-Electrode Silver Paste |
| Core Functions | Form internal conductive coils or electrodes | Key Features | Good fowability,thixotropy,uniformity,and ceramic wettability. The printed electrodes are smooth,dense, anduniform,making them suitable for manufacturing fine conductive adhesive films |
| Application Field | Specifically engineered for internal electrode fabrication in MLCIs,high-frequency inductors,and ferritebeads. It is optimized for fine-line metallization in signal processing and power modules across 5G/6Ginfrastructure,smartphones,and automotive ECUs. | Brand Name | APG |
| Place of Origin | china | Certification | ISO9001、ISO14001、ISO45001、IAFT16949 |
| High Light | Silver Termination Paste ,Inductor Electrode Silver Paste | ||
Silver termination paste is a foundational material for the formation of external inductor electrodes. Formulated from high-purity silver powder, glass frit, and a specialized organic vehicle, it is applied via precision dipping or screen-printing methodologies. Following low-temperature sintering, it develops a highly densified electrode layer that ensures a robust interface between internal coils and external circuitry, providing the necessary resilience for subsequent Ni/Sn electroplating processes.
● High Conductivity
High silver content (typically 80%-90%) with conductivity up to 10⁵ S/cm or higher, ensuring low resistance and minimal signal loss.
● Fine Printing Adaptability
The paste's fineness can be controlled to ≤8μm, supporting 30μm-level line printing, meeting the high-precision multi-layer structure requirements.
● Excellent Co-firing Compatibility
Matches the shrinkage rate of ferrite dielectric materials, avoiding cracking or delamination during sintering and enhancing product reliability.
● Environmentally Friendly and Safe
Complies with lead-free and cadmium-free environmental standards, suitable for export electronic products.
Mainly used for the internal electrode manufacturing of multi-layer chip inductors (MLCI), high-frequency inductors, and magnetic beads. It is widely applied in signal processing and power conversion modules in high-frequency circuits such as smartphones, communication base stations, and automotive electronics.
![]()
Company Details
Ecer Certification:
Verified Supplier
Sputtering Targets for PVD Thin-Film Deposition APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications. Browse sputtering target materials, meta... Sputtering Targets for PVD Thin-Film Deposition APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications. Browse sputtering target materials, meta...
Get in touch with us
Leave a Message, we will call you back quickly!