Shenzhen Huazhisheng New Material Technology Co., Ltd.
| Appearance | Non-flowable paste |
| Tack-free time | 10 min |
| Cured Properties | 7 days @ 23°C, 50% RH |
| Density | 1.04g/cm³ |
| Hardness | 28 |
| Tensile Strength | 1.9 MPa |
| Elongation | 380% |
| Adhesive Strength (Aluminum) | 1.7 MPa |
| Thermal Conductivity | 0.18 W/m·K |
| Volume Resistivity | 1×10¹⁵ Ω·cm |
| Place of Origin | USA |
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Product Specification
| Appearance | Non-flowable paste | Tack-free time | 10 min |
| Cured Properties | 7 days @ 23°C, 50% RH | Density | 1.04g/cm³ |
| Hardness | 28 | Tensile Strength | 1.9 MPa |
| Elongation | 380% | Adhesive Strength (Aluminum) | 1.7 MPa |
| Thermal Conductivity | 0.18 W/m·K | Volume Resistivity | 1×10¹⁵ Ω·cm |
| Place of Origin | USA |
| Property | Condition/Unit | Value |
|---|---|---|
| Uncured Properties | ||
| Appearance | – | Non-flowable paste |
| Tack-free time | 23°C, min | 10 |
| Cured Properties | 7 days @ 23°C, 50% RH | |
| Density | g/cm³ | 1.04 |
| Hardness | Type A | 28 |
| Tensile Strength | MPa | 1.9 |
| Elongation | % | 380 |
| Adhesive Strength (Aluminum) | MPa | 1.7 |
| Thermal Conductivity | W/m·K | 0.18 |
| Volume Resistivity | Ω·cm | 1×10¹⁵ |
| Dielectric Strength | kV/mm | 23 |
| Dielectric Constant | 60Hz | 2.9 |
| Dissipation Factor | 60Hz | 0.004 |
Momentive SNAPSIL™ TSE382-C is a one-component, oxime-cure silicone adhesive sealant that cures at room temperature via ambient moisture. It bonds to metals, plastics, ceramics, and glass without primers, featuring a neutral cure (with corrosion risk to copper/copper alloys). The product delivers exceptional high/low-temperature resistance (-55°C to 200°C continuous), weatherability, ozone resistance, and chemical stability. UL-recognized (File E56745) with UL746 TI Elec. 150°C/Mech. 140°C and UL94 HB ratings.
Dielectric Properties: Volume resistivity of 1×10¹⁵ Ω·cm and dielectric strength 23 kV/mm (after 7-day cure), ideal for high-reliability electronics.
Substrate Adaptability: Graded adhesion solutions for challenging substrates like copper (△), stainless steel (△), and nylon 66 (requires primer YP941).
Safety Compliance: UL certification ensures mechanical/electrical safety in sealed electronics.
Limitations: Poor adhesion to non-polar plastics (e.g., PE, PTFE, marked "X" in TDS).
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer,Exporter,Trading Company,Seller,Other
Year Established:
2018
Total Annual:
5000000-8000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a... Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a...
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