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Shenzhen Huazhisheng New Material Technology Co., Ltd.
DOWSIL™ SE 4485 is a single-component, white, moisture-cure thermal adhesive designed for efficient heat dissipation in electronic modules. Its key attributes include:
Formulation: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
Curing: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
Certifications: UL94 V-0 flammability rating ensures safety in electronic applications.
Color: White for aesthetic compatibility in visible applications.
Product Introduction
This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:
Moisture Resistance: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
Thermal Performance: Delivers a thermal conductivity of 2.8 W/m·K (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
Ease of Use: Semi-fluid consistency allows precise dispensing via automated or manual methods.
Specialized Attributes
Beyond standard specifications, SE 4485 stands out with:
Fast Curing: Achieves tack-free surface in just 10 minutes at 25°C, accelerating production cycles.
High Strength: Offers 492 psi (3.4 MPa) tensile strength and a Shore A hardness of 90 (JIS 1), balancing flexibility and durability.
Chemical Stability: Resists degradation from solvents and maintains performance across a wide temperature range (-45°C to 200°C / -49°F to 392°F).
Environmentally Friendly: Free of corrosive byproducts during curing, aligning with eco-conscious manufacturing practices.
DOWSIL™ SE 4485 Thermal Conductive Adhesive Product Introduction
Product Overview
DOWSIL™ SE 4485 is a single-component, white, moisture-cure thermal adhesive designed for efficient heat dissipation in electronic modules. Its key attributes include:
Formulation: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
Curing: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
Certifications: UL94 V-0 flammability rating ensures safety in electronic applications.
Color: White for aesthetic compatibility in visible applications.
Product Introduction
This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:
Moisture Resistance: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
Thermal Performance: Delivers a thermal conductivity of 2.8 W/m·K (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
Ease of Use: Semi-fluid consistency allows precise dispensing via automated or manual methods.
Application Scenarios
SE 4485 is ideal for scenarios demanding efficient heat management, including:
Consumer Electronics: Cooling LED lighting systems, smartphones, and laptops.
Industrial Equipment: Power supplies, automotive electronics, and telecom devices.
Emerging Technologies: Electric vehicle battery modules and renewable energy systems.
Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a... Shenzhen Huazhisheng New Materials Technology Co., Ltd. is a leading provider of environmentally friendly adhesives and technical solutions, specializing in the application of modified silicone rubber, epoxy adhesives, thermal materials, bonding adhesives, encapsulation adhesives, and UV adhesives a...
