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Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

Categories Phase Changing Materials
Brand Name: Ziitek
Model Number: TIC™800G series
Certification: RoHs
Place of Origin: China
MOQ: 1000PCS
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bay
Product Name: Phase Changing Materials
Color: Gray
Thermal Conductivity: 5.0 W/mK
Density: 2.6g/cc
Temperature range: -25℃~125℃
Thermal Impedance @ 50 psi(345 KPa): 0.014℃-in²/W
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    Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density

    Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density


    TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

    TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


    Applications Include:


    > High Frequency Microprocessors
    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs


    Features:


    For Lowest Thermal Resistance :
    > 0.014℃-in² /W thermal resistance
    > Naturally tacky at room temperature,
    no adhesive required
    > No heat sink preheating required


    Typical Properties of TICTM800G Series
    Product NameTICTM805GTICTM808GTICTM810GTICTM812GTest Method
    ColorGrayGrayGrayGrayVisual
    Thickness0.005"
    (0.126mm)
    0.008"
    (0.203mm)
    0.010"
    (0.254mm)
    0.012"
    (0.305mm)
     
    Thickness Tolerance±0.0008''
    (±0.019mm)
    ±0.0008''
    (±0.019mm)
    ±0.0012''
    (±0.030mm)
    ±0.0012''
    (±0.030mm)
     
    Density2.6g/ccHelium Pycnometer
    Temperature range-25℃~125℃ 
    Phase Change Softening Temperature50℃~60℃ 
    "Burn In" Temperature70℃ for 5 minutes 
    Thermal Conductivity5.0 W/mKASTM D5470 (modified)
    Thermal Impedance @ 50 psi(345 KPa)0.014℃-in²/W0.020℃-in²/W0.038℃-in²/W0.058℃-in²/WASTM D5470 (modified)
    0.09℃-cm²/W0.13℃-cm²/W0.25℃-cm²/W0.37℃-cm²/W

    Standard Thicknesses:


    0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
    Consult the factory alternate thickness.


    Standard Sizes:


    10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

    Peressure Sensitive Adhesive:


    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

    Reinforcement:
    No reinforcement is necessary.

    Quality Low Melting Point Thermal Phase Changing Materials 5 W / mK with 2.6g / cc Density for sale
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